Gap in core chip manufacturing, equipment capabilities: Industry executives

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While India has traditionally excelled in chip design and application development, top semiconductor equipment makers pointed to a gap in core semiconductor manufacturing and equipment capabilities, Radhika Viswanathan, chief operating officer of semiconductor equipment manufacturer Applied Materials, said in an address.

She was speaking at the India Electronics and Semiconductors Association (IESA) Vision Summit here on Wednesday.

American supplier of wafer-fabrication equipment Lam Research Managing Director Rangesh Raghavan highlighted a $50 billion supply chain opportunity, and expanded R&D investments.

Raghavan said the semiconductor industry is on the cusp of crossing the trillion-dollar mark, fuelled by explosive growth in artificial intelligence (AI). The equipment segment, he said, has seen dramatic value creation with the top four global equipment makers ASML (Netherlands); Applied Materials (US); Tokyo Electron (Japan) and Lam Research (US) together exceeding a trillion dollars in market capitalisation.

Building India’s ‘missing middle’

“What we are missing is the middle: the equipment manufacturing, chip fabrication and end-to-end device systems,” Viswanathan said.